Copper plating process for thick copper PCB

In the thick copper plating process of thick copper PCB, the process parameters must be monitored frequently, which often causes unnecessary losses due to subjective and objective reasons. To do a good job in thickening copper plating process, you must do the following aspects:

1. Add a certain value based on the area value calculated by the computer and the empirical constant accumulated in actual production;

2. According to the calculated current value, in order to ensure the integrity of the coating in the hole, it is necessary to add a certain value to the original current value, that is, the impulse current, and then return to the original value in a short time;

3. When the circuit board is electroplated for 5 minutes, take out the substrate and observe whether the copper layer on the surface and the inner wall of the hole is intact. It is better that all the holes have a metallic luster;

4. A certain distance must be maintained between the substrate and the substrate;

5. When the thick copper plating reaches the required electroplating time, a certain amount of current must be maintained during the removal of the substrate to ensure that the surface of the substrate and the hole will not be blackened or darkened.