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Process Technology Capability

Project	Capability of Technology
Impedance control Tolerance	±5%
HDI	1+N+1
Aluminum PCB(Metal core)	volume production
copper core	volume production
BT material	volume production
Multiayer	volume production
Surface finishing	ENIG/HAL/OSP/Immersion silver/ENIG/flash gold/ENEPIG
Layers count	2-30
Maximum Board Size	6101800mm 6101000mm
minimum thickness of board	0.1mm
Maximum thickness of board	8.0mm
Thickness of inner core	0.05mm(Does not contain copper)
Finished copper thickness	core 80z outer layer 80z
Minimum line width/lin Space	0.05mm
Mechanical drilling hole size	0.1mm
Minimum diameter blind hole	0.075mm
The Max aspect ratio	18.01