HDI PCB is the abbreviation of High Density Interconnector. It is a kind of (technology) for the production of printed circuit boards. It is a circuit board with a relatively high line distribution density using micro-blind and buried via technology. HDI is a compact product designed for small-capacity users. HDI PCB adopts a modular and parallel design, a module capacity of 1000VA (1U height), natural cooling, can be directly placed in a 19" rack, and a maximum of 6 modules can be connected in parallel. The HDI PCB product adopts full digital signal processing (DSP) technology and multiple Patented technology, with full range of adaptable load capacity and strong short-term overload capacity, regardless of load power factor and crest factor.
HDI PCB is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI PCB are generally manufactured by the build-up method. The more build-up times, the higher the technical grade of the board. Ordinary HDI boards are basically one-time build-up. High-end HDI uses two-time or more build-up technology. At the same time, advanced PCB technologies such as stacking holes, electroplating and filling holes, and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.